TUM Asia Career & Internship Fair 2014: Open to Alumni

Attention ALL Alumni and Students, the annual TUM Asia Career & Internship Fair is here!

The TUM Asia Career & Internship Fair 2014 is an excellent platform for you to meet with potential employers and learn more about their career or internship opportunities and their hiring criteria.

Do not miss this opportunity to network with potential hirers! This is your opportunity to brush up your interpersonal skills and learn how to talk to employers – for all you know, you might land that job or internship!

Date: 14th March 2014, Friday
Time: 11am – 5pm
Venue: TUM Asia Pixel Campus
Target Audience: All Alumni and Students
Attire: Formal
Registration: Only for Alumni and Students who are from AY 2012 and earlier (please register below). All AY 2013/14 MSc students & BSc students DO NOT NEED to register as you are expected to attend. Registration closes 13 March 2014, 4:00PM.

 In addition to the employers’ exhibition, there will also be a series of recruitment talks by the various participating companies. Please see below for the Career Talk Schedule.

11:00AM – 11:30AM A*STAR Bioprocessing Technology Institute
11:30AM – 12:00PM 
Silicon Labs

12:00PM – 12:30PM Lantiq Asia Pacific
12:30PM – 1:00PM Pepperl + Fuchs
1:00PM – 1:30PM SDV Logistics
1:30PM – 2:00PM Continental Automotive
2:00PM – 2:30PM Wincor Nixdorf
2:30PM – 3:00PM Advanced Micro Devices (AMD)
3:00PM – 3:30PM Robert Bosch (SEA)

To ensure that your visit to the TUM Asia Career & Internship Fair 2014 is a fruitful one, you are advised to dress appropriately, bring along your resumes and be prepared to undergo any on-the-spot interviews.

We look forward to seeing you there!

Don’t miss the opportunity to meet your potential hirers here:

Acumen Research Laboratories
Advanced Micro Devices (AMD)
ASM Technology
Continental Automotive Singapore Pte Ltd
Global Foundries
HGST Singapore
Infineon Technologies
Lantiq Asia Pacific
Marvell
Micron Semiconductor Asia
OMEGA Integration
Pepperl + Fuchs
Pfeiffer Vacuum
Qualcomm Global Trading
Resin & Pigment Technologies Pte Ltd
Robert BOSCH (SEA)
Rohde & Schwarz
SDV Logistics
Silicon Laboratories International Pte Ltd
STMicroelectronics
TÜV SÜD PSB
TUM Create
Wincor-Nixdorf
Xilinx Asia Pacific
YCH Group Pte Ltd

Registration has closed. If you have not registered, you are still welcome to attend the Fair.

© 2024 Technische Universität München Asia
German Institute of Science & Technology - TUM Asia Pte Ltd
PEI Reg. No. 200105229R | Registration Period 13.06.2023 to 12.06.2029

 
tum arrow up