Master of Science (M.Sc.)

Integrated Circuit Design

Type of Study
Full Time

Application period
Admissions open soon

Duration
4 semesters over 2 years

Next intake
August 2025

Credits
120 ECTS

Awarding university
TUM & NTU (Nanyang Technological University)

The Master of Science in Integrated Circuit Design emphasises the theoretical and practical fundamentals of integrated circuit (IC) design, enhancing students’ specialised knowledge in analogue, mixed-signal, and digital circuits to meet today’s rapidly increasing performance demands in IC design. This programme enables students to master architectural concepts, design methodologies, and automation for IC design. Students will gain a strong foundation in signal processing, which is essential for the success of modern communication circuits.

Highlights

As new and attractive applications for the use of ICs open up, the semiconductor industry has grown exponentially. Modern technology and knowledge have also enabled us to integrate billions of transistors into a single integrated circuit, leading to the creation of numerous modern devices.

Analog and Digital IC Design

Gain knowledge and practical insights into analog IC design with electronic design automation (EDA) tools, and Digital IC design flow to build circuitry with standardised components.

Design Methodology

Design methodology and automation, together with system-level architecture, modelling and analyses.

Semiconductor Processes

Semiconductor process technology and devices for designing mixed signal circuits containing both analog and digital circuitry.

19th in Engineering
QS World University Ranking by Subject
26th
World University Ranking

Times Higher Education (THE) 2025

~300
International Students Graduated

Learning Outcomes

Awarded and developed by:

Successful completion of this programme will equip graduates with the capabilities in:
Advanced knowledge ranging from analog, digital, and mixed-circuit design to architectural concepts for integrated circuits, design methodology, and automation
Insights into product manufacturing and testing
Fundamental concepts of signal processing, focusing on the analysis and optimisation of signals
Insights into business management and administration, as well as marketing and international intellectual property laws

Career Prospects

Graduates will acquire the skills and knowledge needed to excel in research roles within industry or academia. They will be well-prepared to work independently in research laboratories and thrive in multinational companies, with a clear understanding of their complex organisational structures.

Career Opportunities

Place & Route Engineer

Layout Engineer

Integrated Circuit Designer

Research and Development

Design Validation Engineering

Analogue IC Design Engineer

Success Stories

Huang Shichen
PhD Student at TUM, Germany

Class of 2024, Master of Science in Integrated Circuit Design

READ STORY

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Programme Structure

The MSc in Integrated Circuit Design, totalling 120 ECTS, spans 4 semesters over 2 years, comprising a combination of laboratory, core and elective modules (70 ECTS or 48 AUs), a 3-month internship (20 ECTS), and a 6-month master’s thesis (30 ECTS).

Curriculum

Laboratory Elective Modules

The module covers the following topics:

  • Introduction to Cadence design tools
  • CMOS high-speed analog circuits, HF characteristics of CMOS transistors and integrated passive elements
  • Low noise amplifier, mixer, VCO, prescaler, power amplifier, transceiver as a complete system
  • Overview and fundamental analysis of the building blocks of a Power Management ASIC (PMU) and their usage in the system

The module covers the following topics:

  • Synchronous digital circuit concept
  • Description of sequential and combinational logic cells
  • Basic components of digital circuits
  • State machines
  • Simulation
  • Synthesis, static timing analysis
  • Implementation and test

Core Technical Elective Modules (Choose 6)

The module covers the following topics:

  • Review of Integrated Circuit Fundamentals
  • Layout and Design Issues
  • CMOS Circuit designs
  • Low Power Design
  • BiCMOS Digital Circuits
  • Sub-System Design in Digital Circuits
  • Design Methodologies

The module covers the following topics:

  • Review of fundamentals
  • Noise
  • Modeling
  • Analog building blocks
  • Components layout
  • Switched capacitor circuits
  • Current mode circuits
  • Transconductor
  • Auto-tuning
  • Gm-C and MOSFET-C filters
  • Continuous-time filters
  • Switch current circuits
  • Class D amplifiers
  1. Basics of CMOS integrated circuits from a system’s perspective
    • From MOSFET transistor to realisation of combinatorial/sequential logic, Finite State Machines (FSM), SRAM, DRAM, FLASH, FPGA, CPU core building blocks
    • Packaging and I/O technology
    • System modelling
    • Projection of IC technology scaling and implementation alternatives
    • Moore’s law and what it will mean for different IC technologies today and in the future
  2. Investigation of the role and applicability of IC technology blocks in state-of-the-art VLSI products from various vendors in the form of case studies
    • Ethernet LAN MACs and switches
    • Control point processors and communication controllers
    • Network processors
    • Backplane and SAN (System Area Network) switches
    • SONET/SDH transport framers and digital cross connects

The module covers the following topics:

  • Computer-aided design of primarily digital integrated circuits
  • VLSI design flow
  • Overview of system-level, algorithmic-level, register transfer level, logic level, circuit level VLSI design methods
  • Focus on logic synthesis, digital simulation, and testing
  • Techniques from discrete mathematics and computer science
  • Emphasis on techniques applicable to very complex, industrially relevant circuits

The module covers the following topics:

  • Introduction
  • Discrete Fourier transform (DFT) and fast Fourier transform (FFT)
  • Z transform
  • Digital filters
  • Linear prediction and optimum linear filters
  • Power spectrum estimation

The module covers the following topics:

  • Specifics of semiconductor process technology and devices for the building of integrated circuits
  • Transistor level circuits and their implementation in CMOS technology: amplifier, current and voltage reference, power supply, clock generation, regulation, and distribution, A/D and D/A converters
  • Non-idealities and their compensation: operating point, frequency response (with feedback), optimisation for disturbances (parasitic, power supply, and common mode rejection, etc.), and error sources (variability, noise, etc.)

The module covers the following topics:

  • Plastic packaging materials
  • Manufacturing processes for plastic encapsulated microelectronics
  • State-of-the-art packaging techniques
  • Failure mechanisms, sites, and modes
  • Qualification process
  • Accelerated testing for packaging
  • Effects of packaging on the electrical performance
  • Future trends and challenges in packaging

Specialisation Technical Elective Modules (Choose 4)

The module covers the following topics:

  • System design considerations
  • CMOS RF components and devices
  • Low-noise amplifier (LNA)
  • Mixers
  • Voltage-controlled oscillators (VCOs)
  • RF power amplifiers (PA)
  • Phase-locked loops (PLL) and frequency synthesizers

The module covers the following topics:

  • Trends in the IC industry: technology and manufacturing trends, demand applications and product trends
  • Market characteristics: the customers, business cycles, demand lead and supply lag (the bull-whip effect)
  • IC industry, supply and value chain, stakeholders
  • Geographical distribution of excellence centres, technology centres, design centres, fabrication centres
  • The dis-integration of the value chain, outsourcing trends
  • Managing the marketing function: the sources of product ideas, the role of standards, formats, and intellectual property
  • Strategic partnership, distributorship
  • Demand forecast, matching supply with demand

The module covers the following topics:

  • Historical development of mainstream MOSFETs until today
  • Economical, technological and physical fundamentals
  • Properties of long channel and short channel MOSFETs, hot carrier effects
  • Short channel effects, scaling rules
  • Basics of charge carrier transport (quantum mechanical, hydro dynamics, ballistics)
  • Proposed new MOSFET structures (strain engineering, metal-gate, high-k, vertical MOSFETs, double gate MOSFETs)
  • Hot electron transistors
  • Tunneling transistors
  • Low dimensional devices
  • Single electron transistor, single electron memories, quantum electronics

The module covers the following topics:

  • Low dimensional structures: quantum wells, quantum wires and quantum dots
  • Electronic, optical, transport properties of nanostructures
  • Quantum semiconductor devices
  • Fabrication and characterisation techniques of nanotechnology
  • Applications of nanostructures, nanodevices and nanosystems
  • The bottom-up approach to nanotechnology: introduction to molecular electronics and optoelectronics
  • Organic materials for electronics: self-assembled monolayers; conducting polymers; carbon nanotubes
  • Circuit implementations and architectures for nanostructures: quantum cellular automata and cellular nonlinear networks
  • Introduction to quantum computing

The module covers the following topics:

  • Fault models and testability concepts
  • Test generation and fault simulation algorithms
  • Shift-register polynomial division
  • Pseudo-random sequence generators
  • Special purpose shift register circuits
  • Random pattern BIST
  • Built-in boundary scan structure
  • Limitations and other concerns of random pattern test
  • Test techniques for automatic test equipment

The module covers the following topics:

  • Basics of embedded processor architectures
  • Bus and memory architectures
  • Performance/timing analysis of embedded systems
  • Models for real-time systems
  • Principles of embedded software development
  • Basic real-time programming language concepts (e.g. Esterel)
  • Real-time operating systems
  • Power management
  • Design space exploration

The module covers the following topics:

  • Principles of circuit simulation: DC/AC/TR analysis
  • Basic analog optimisation tasks: worst-case analysis, yield analysis, nominal design and design centering
  • Basic principles of optimisation: optimality conditions, line search, Nelder-Mead method, Newton approach, Conjugate Gradient approach, Quadratic Programming, Sequential Quadratic Programming
  • Structural analysis of analog circuits
  • Application of a commercial analog optimisation tool (WiCkeD) to an analog design example

Non-Technical Elective Modules (Choose 2)

This module provides students with a solid business foundation for the theory and practice of managing different forms of enterprises, focusing on the various financing instruments, capital budgeting methods, corporate valuation procedures, methods and requirements of internal and external accounting, and human resource management and theories. Through this module, students will be able to create a business plan and harness the suite of financing instruments to determine the profitability of investments and the value of firms.
This module provides a holistic understanding of the principles of marketing, where students gain comprehensive knowledge of marketing strategies and the marketing environment, customer value, satisfaction, and loyalty, as well as information management and marketing research. Students will also learn how to proficiently analyse consumer and business markets, compete and differentiate from competitors, segment, target, and establish a strong market position. In particular, students will explore the main pillars of marketing channels, including pricing, products and services, and learn how to manage a brand to create a competitive marketing strategy for any product or service.

Manufacturers are confronted with special requirements of their production processes. Cycles, by-products, batches and campaigns are difficult to handle by nowadays ERP software packages (ERP = Enterprise Resource Planning). Concepts of material requirements planning, supply chain management (SCM) combined with basics in cost accounting will be explained. As a highlight a simulation model, based on modern simulation software, will be used by students to simulate production planning and achieve the ‘best’ production plan. The module covers the following topics:

Part A: Overview
Part B: Industries – Chemical, Plastics and PVC
Part C: The World of PVC
Part D: Production Planning – Introduction
Part E: Production Planning Process
Part F: Procurement Process
Part G: SAP & Enterprise Resource Planning
Part H: Simulation Theory and Simulation Models

This module provides students with foundational knowledge in developing technologies and innovation by combining business theory with practical guidance. Through engaging in discussions on the dynamics of technological development through innovation and related management issues and practices, students will be able to proficiently navigate the various dynamics in technology- or innovation-based business environments. Students will also be able to demonstrate the principles of the primary four forces of innovation and identify the critical role that finance plays in innovation to lead to job creation and economic growth.
The module will provide insights into the core elements of Industry 4.0 such as: introduction to Cyber-Physical System, Radio Frequency Identification (RFID) technologies, information collection with intelligent sensors, industrial networking to connect the machines and processes together, Manufacturing Execution System (MES) for order management, production control and value adding to the complete supply chain management.
This module will give a brief introduction to intellectual property rights and focus on insights into general principles of patent law and international conventions governing the patent law. Current developments and criticism of the current patent law system will also be addressed. In addition, practical (legal) aspects of the commercialisation of patents will be dealt with.
This module introduces the principles of Project Management, which addresses the key aspects of the project management processes and frameworks for successful projects. The skills and understanding of principles of project management is a key for the project manager to lead, plan, and implement projects to help their organisations succeed by achieving the common objectives within designated scope, cost, and timeline. The module introduces tools, techniques, and frameworks to engage effective stakeholders’ communication, monitor the project life cycle, and consistently develop the project with its deliverables. In this course, the student will learn how to initiate, manage, monitor, and then close the project. This module will also include a basic understanding of predictive and adaptive approaches commonly used in various projects and various industries.
*Disclaimer: Specialisation and Elective modules available for selection are subject to availability. Unforeseen circumstances that affect the availability of the module include an insufficient number of students taking up the module and/or the unavailability of the professor. TUM Asia reserves the right to cancel or postpone the module under such circumstances.

Global Internship

Gain real-world experience through internships, where you can take an active role in securing opportunities at a company of your choice, anywhere in the world.

The internship programme embodies the hallmarks of all TUM Asia’s master’s programmes where students are given the opportunity to shape their career trajectory and put the theoretical knowledge into practice. Students complete a three-month internship with the industry or an academic institution of choice related to his or her field of study at TUM Asia.

Internship can be completed anywhere in the world.

Students are empowered and given the freedom to pursue internship in their desired fields anywhere in the world and explore the possible career pathways developed from their field of study based on their career goals and aspirations.

Our Students’ Internship Experience :

[Fabian D’ Cruz]
[Occupation]
[Class of 2022, Master of Science in Rail, Transport and Logistics ]

PLAY VIDEO

Master’s Thesis

A six-month journey that enables you to apply the best of your knowledge and skills acquired through course work and research assistantships

Through this guided learning experience, students work in collaboration with industry partners or other researchers on a project of mutual interest and gain the opportunity to publish manuscripts.

The master’s thesis is fully practical based. Theoretical frameworks or conceptual models can be occasionally used to guide research questions.

Admission Criteria

Applicants must have a bachelor’s degree in Electrical/ Electronics Engineering or in a closely related discipline with remarkable results

Required Test Scores

For applicants whose native language or language of instruction from previous studies is not English, a TOEFL / IELTS score is required.
For more information:
  • TOEFL (www.toefl.org): Recent score with a Minimum 88* for the Internet-Based Test (TOEFL code: 7368)
  • IELTS (www.ielts.org): With academic IELTS result of at least 6.5

For applicants with a Chinese, Vietnamese or Indian university degree, an Akademische Prüfstelle (APS) certificate is required.

Find out more about our application process

For applicants whose native language or language of instruction from previous studies is not English, a TOEFL / IELTS score is required. For more information:

  • TOEFL (www.toefl.org):
  • IELTS (www.ielts.org):
IELTS

6.5

With academic IELTS result of at least 6.5
TOEFL

88+

Recent score with a Minimum 88* for the Internet-Based Test (TOEFL code: 7368)

For applicants with a Chinese, Vietnamese or Indian school or university degree, an Akademische Prüfstelle (APS) certificate is required.

For more information, please visit here.Link

Fees & Finances

Tuition Fees​

The tuition fees are payable upon acceptance of offer across 3 instalments throughout the academic year.

Payment can be made through:

Registration Fee 1st Instalment 2nd Instalment 3rd Instalment Total*
Payment Schedule
Upon acceptance of offer
15 July
1 December
1 July (of the next year)
Gross Amount* (before GST)
S$5,000.00
Payable across 3 instalments
S$49,000.00
Final Amount* (after GST)
S$5,450.00
Payable across 3 instalments
S$53,410.00

Total programme fee: S$53,410* (inclusive 9% GST)

  • All fees quoted are in Singapore Dollars and are inclusive of the prevailing Goods and Services Tax (GST) imposed under the Singapore GST Act. The GST rate has been adjusted to 9% starting from 1 January 2024
  • Tuition fees are subject to changes in Government Legislation or duly determined by the University Management. Students will be informed accordingly.
Scholarships
Admissions FAQ

Additional Information

  • Matriculation fees at TUM, teaching and examination fees
  • Lab materials and expenses
  • Expenses for intercultural program, may include tickets for events and industry excursions
  • Soft copy files of all teaching materials
  • IT usage: Internet access
  • Excursion and off-campus expenses for mandatory events
  • Usage of all university facilities at TUM and TUM Asia
  • Student Visa Processing and Issuance Fee (payable to the Immigration & Checkpoints Authority (ICA) Singapore
  • Student Services Fees*
  • Health Service Fees*
  • Application Fees*: Applicants are required to pay a non-refundable NTU application fee of SGD 50 when sending in their admission application.

*The fees are payable to the Nanyang Technological University (NTU). Note: Fees are subject to revision. All prices would be inclusive of the prevailing GST rates. The respective amounts and payment instructions will be provided in the Student Agreement to all successful applicants

Professors

Prof Herkersdorf
Prof. Dr. Sc. Techn. Andreas Herkersdorf
Screenshot 2019-05-27 at 3.33.02 PM
Dr. Zheng Yuanjin
Prof-Siek-Liter
Assoc. Prof. Siek Liter
Screenshot 2019-05-27 at 3.17.50 PM
Dr. Ji-Jon Sit
Screenshot 2019-05-24 at 1.35.33 PM
Dr.- Ing Josef Biba
Tony_New
Prof. Kim Tae Hyoung
LimMengHiot
Assoc. Prof. Lim Meng Hiot
StaffPhoto
Prof. Chang Chip Hong
Dr_Helmut_Graeb_B&W
Apl. Prof. Dr.-Ing. habil. Helmut Graeb
Prof. Dr.-Ing. Ulf Schlichtmann
Prof. Dr.-Ing. Ulf Schlichtmann
Prof Goh Wang Ling
Assoc. Prof. Goh Wang Ling
Prof. Samarjit CHAKRABORTY
Prof. Samarjit Chakraborty
Prof Tan Chuan Seng
Prof. Tan Chuan Seng
Prof Gwee Bah Hwee
Assoc. Prof. Gwee Bah Hwee
Prof Zhiping Lin
Assoc. Prof. Lin Zhiping

Upcoming Events

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