Master of Science (M.Sc.)

Green Electronics

Type of Study
Full Time

Application period
Admissions open soon

Duration
4 semesters over 2 years

Next intake
August 2025

Credits
120 ECTS

Awarding university
TUM & NTU (Nanyang Technological University)

The Master of Science in Green Electronics encompasses state-of-the-art research and industrial advancements in today’s semiconductor manufacturing technologies. This joint programme equips students with advanced knowledge in micro-/nano-fabrication technology, as well as cutting-edge theories in renewable energy, power semiconductors, and organic semiconductor devices and systems.

Highlights

Aimed to nurture the next generation of semiconductor researchers and engineers, students will be able to specialise in various areas of novel electronic/ optoelectronic devices and systems, focusing on the energy, sensing, monitoring and manufacturing fields

Conventional Electronics

Conventional semiconductor manufacturing technology including materials, devices and manufacturing process to fabricate electronic devices of smaller size and higher density

Organic Electronics

Carbon and organic electronics, photovoltaic, sensor and display technology which include the corresponding materials, devices and manufacturing process to facilitate the fabrication of novel, flexible and large-area devices

Green Technology

Green technology for energy harvesting, wireless sensor networks and cyber systems for smart cities

19th in Engineering

QS World University Ranking by Subject
26th
World University Ranking

Times Higher Education (THE) 2025

~300
International Students Graduated

Learning Outcomes

Awarded and developed by:

Successful completion of this programme will:

Equip graduates with capabilities in conventional semiconductor manufacturing technology including materials, devices and manufacturing processes.

Develop proficiency in harnessing carbon and organic electronics, photovoltaic, sensor and display technology including their corresponding materials, devices and manufacturing process

Design and develop efficient and high-performance systems leveraging green technology for energy harvesting, wireless sensor networks and cyber systems

Gain insights into business management, administration, marketing and international intellectual property laws.

Career Prospects

Graduates will acquire the skills and knowledge needed to excel in research roles within industry or academia. They will be well-prepared to work independently in research laboratories and thrive in multinational companies, with a clear understanding of their complex organisational structures.

Career Opportunities

Research Engineer

Device Engineer

Failure Analysis Engineer

Yield Enhancement Engineer

Process Integration Engineer

Product Development Engineer

Success Stories

Brandon d’Cruz
Semiconductor Engineer, Micron Technology, Singapore

Class of 2024, Master of Science in Green Electronics

READ STORY

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Programme Structure

The MSc in Green Electronics, totalling 120 ECTS, spans 4 semesters over 2 years, comprising a combination of laboratory, core and elective modules (70 ECTS or 48 AUs), a 3-month internship (20 ECTS), and a 6-month master’s thesis (30 ECTS).

Curriculum

Laboratory Elective Modules

The module covers the following topics:

  • Process models: diffusion, oxidation, implantation
  • Process variables and targets: doping profiles, junction depths, oxide thickness
  • Process simulation: simulation of a given sub-micron CMOS process recipe to study profiles and layer structures
  • Physical models, numerical algorithms, and solutions
  • Device performance parameters and short-channel effects
  • DC simulations
  • Device simulation: simulation of the DC characteristics of the “fabricated” device and analysis of device operation with respect to potential, field, and carrier distributions, as well as terminal I–V characteristics
  • Wafer-split experiments
  • Device-target versus process-variable relations
  • Transistor performance optimisation and trade-offs through process variation
  • Technology development and optimisation
  • Design of Experiment (DOE): implementation of a computer experiment to study the scaling characteristics (e.g., varying gate length) of the given sub-micron technology and the influence of process variations on device performance parameters

The module covers the following topics:

  • Part I
    • MOSFET analytical equations
    • Short-channel effects
    • Compact models for circuit simulation
    • Parameter extraction
    • Transistor optimisation
  • Part II
    • Semiconductor fundamentals
    • Simulation of Si, Ge, and Sn band structures
    • Quantum well (QW), energy subbands, and wave functions using the k⋅pk \cdot pk⋅p method
    • QW band structure calculation using single-band and 6-band k⋅pk \cdot pk⋅p methods
    • Density of states, doping concentration, and Fermi energy level calculations using single-band and 6-band k⋅pk \cdot pk⋅p methods
    • Intersubband (intraband) transitions and squared transition element calculations
    • Absorption spectrum and cut-off wavelength of QW infrared photodetectors
    • Influence of Ge composition and well width on the peak wavelength of photodetectors
    • Optical gain simulation of Ge QWs on Si

Core Technical Elective Modules (Choose 6)

The module covers the following topics:

  • Photolithography technology
  • Photoresist technology
  • Advanced lithography
  • Metrology defect inspection and analytical techniques
  • Cleaning technology
  • Wet etching process and technology
  • Dry etching process and technology
  • Chemical mechanical polishing
  • Epitaxy
  • Plasma-enhanced chemical vapour deposition
  • Atomic layer deposition
  • Physical vapour deposition

This module will focus on optical principles and their application in green electronics production processes, photovoltaic devices, thin film measurement, display technology, distributed sensor networks, and energy harvesting. In particular, the module will address the following topics (inter alia):

  • Fundamentals of optomechatronic measurement systems
  • Light sources and detectors
  • Refraction, interference, and diffraction
  • Electronic speckle pattern interferometry
  • Thin film reflectometry as an in-situ deposition sensing technique
  • Ellipsometry for thin layer analysis
  • Optical waveguide sensors and their application in renewable energy devices such as wind turbines
  • Fourier transform infrared spectroscopy for the detection of greenhouse gases
  • Applications of optomechatronic measurement technology in the green electronics industry, including a fundamental understanding of patent protection and patent strategy for optomechatronic measurement devices

The module covers the following topics:

  • Bonding between atoms
  • Electronic and atomic structures
  • Basic crystal structures
  • Energy band
  • Semiconductors, insulators, and organic materials
  • Defects and doping
  • Surface and interface
  • Functional properties of materials
  • Compound semiconductors
  • Nanostructures
  • Electronic ceramics

The module covers the following topics:

  • Introduction to bionanotechnology
  • Materials: electrolytes, organic molecules, lipid bilayers, DNA, proteins
  • Nanofabrication techniques and self-assembly
  • Biofunctionalisation of solid surfaces
  • Surface analytics and characterisation
  • Electrical biosensors: solid-liquid interface, surface plasmon resonance, quartz microbalance, electrochemical impedance, nanopores, nanowires
  • Charge transfer in biomolecules: fundamentals and applications

The module covers the following topics:

  • Approaches to nanotechnology: bottom-up vs. top-down
  • Characterisation and fabrication issues in the nanoscale
  • Applications of nanotechnology in electronics, optoelectronics, telecommunications, medicine, biology, mechanics and robotics
  • Overview of nanotechnology programs in the USA, Japan and Europe
  • Nanomaterials and nano-systems for energy applications
  • Examples of nanotechnology in energy production, energy storage, energy harvesting, and high voltage technologies
  • A look into the future: electro and photocatalysis, hydrogen production and storage
  • Economic implications of nanotechnology in the energy field

The module will focus on the operational principles and underlying physical effects of microstructured electronic and mechatronic devices and microsystems and their application fields. In particular, the module will address the following topics:

  • Basic physical effects in solid-state microstructured electronic and micromechatronic devices and their application fields (microelectronics, microsensors, microactuators, and microsystems)
  • Characteristic material properties of semiconductors: intrinsic and extrinsic electrical conductivity, mobility, charge carrier transport by drift and diffusion, carrier generation-recombination, thermal conductivity, energy domain coupling effects (thermoelectricity, piezoresistance, piezoelectricity, thermoelasticity, galvanomagnetism, etc.)
  • Basic operational principles of microdevices: pn junction, MOS field effect, unipolar and bipolar electronic devices, power devices, various transducer effects
  • Phenomenological transport theory: Onsager’s transport model, continuous field models of energy-coupled multi-domain systems, physics-based macro-modeling of microsystems
  • Selected sensor and actuator application examples

The module covers the following topics:

  • Structure of the power system: generation, transportation, distribution, and electricity consumption
  • Introduction to typical power plant types including new renewable technologies. Description of the transport, distribution, and control philosophy
  • Introduction to electricity demand, especially due to new electronic services. Fundamental terms of energy economy and electricity markets
  • Introduction to smart grids

Specialisation Technical Elective Modules (Choose 4)

The module covers the following topics:

  • Bipolar transistor operation principles
  • Bipolar device modelling
  • State-of-the-art bipolar structures
  • CMOS device scaling effects
  • Semiconductor memories
  • Future trends and challenges

The module covers the following topics:

  • Historical development of mainstream MOSFETs until today
  • Economical, technological and physical fundamentals
  • Properties of long channel and short channel MOSFETs, hot carrier effects
  • Short channel effects, scaling rules
  • Basics of charge carrier transport (quantum mechanical, hydrodynamics, ballistics)
  • Proposed new MOSFET structures (strain engineering, metal-gate, high-k, vertical MOSFETs, double gate MOSFETs)
  • Hot electron transistors
  • Tunnelling transistors
  • Low dimensional devices
  • Single electron transistor, single electron memories, quantum electronics

The module covers the following topics:

  • Third generation photovoltaics
  • Quantum dot tandem cells
  • Hot carrier cells
  • Multiple electron hole pair generation
  • Impurity and intermediate band devices

The module covers the following topics:

  • Energy flow in environment
  • Optical properties of nanomaterials
  • Spectral selective windows
  • Solar thermal collectors
  • Solar cells
  • Cooling and energy harvesting
  • Electrochemical energy storage

The module covers the following topics:

  • Fundamentals of electronic and optoelectronic devices and technologies based on polymer semiconductors
  • An overview of Polymer Electronics
  • Electronic structure and band theory
  • Beyond polyacetylene
  • Optoelectronic properties
  • Charge transport
  • Synthesis and macromolecular design
  • The physics of polymers
  • Surfaces and interfaces
  • Polymer transistors
  • Optoelectronic devices
  • Photovoltaic devices (organic and dye sensitised solar cells)
  • Polymeric memories

The module will focus on the function and operational principles of today’s semiconductor power devices and their use in specific applications. In particular, the module will address the following topics:

  1. Fundamentals of semiconductor device physics: electronic band structure, intrinsic and extrinsic conductivity, mobility, carrier transport by drift and diffusion, carrier generation and recombination, impact ionisation, pn-junction, MOS field effect
  2. Power device structures:
    • PIN diode
    • Schottky diode
    • Bipolar junction transistor
    • Thyristor
    • Power MOSFET
    • Insulated gate bipolar transistor (IGBT)
  3. Robustness and destruction mechanisms of power devices:
    • Thermal breakdown
    • Electrical breakdown
    • Dynamic avalanche
    • Latch-up in IGBTs
    • Cosmic ray induced failure

Non-Technical Elective Modules (Choose 2)

This module provides students with a solid business foundation for the theory and practice of managing different forms of enterprises, focusing on the various financing instruments, capital budgeting methods, corporate valuation procedures, methods and requirements of internal and external accounting, and human resource management and theories. Through this module, students will be able to create a business plan and harness the suite of financing instruments to determine the profitability of investments and the value of firms.
This module provides a holistic understanding of the principles of marketing, where students gain comprehensive knowledge of marketing strategies and the marketing environment, customer value, satisfaction, and loyalty, as well as information management and marketing research. Students will also learn how to proficiently analyse consumer and business markets, compete and differentiate from competitors, segment, target, and establish a strong market position. In particular, students will explore the main pillars of marketing channels, including pricing, products and services, and learn how to manage a brand to create a competitive marketing strategy for any product or service.

Manufacturers face unique challenges in their production processes. Cycles, by-products, batches, and campaigns are difficult to manage with current ERP (Enterprise Resource Planning) software packages. Concepts such as material requirements planning, supply chain management (SCM), and basic cost accounting will be explained. As a highlight, a simulation model based on modern simulation software will be used by students to simulate production planning and develop the ‘best’ production plan. The module covers the following topics:

Part A: Overview
Part B: Industries – Chemical, Plastics and PVC
Part C: The World of PVC
Part D: Production Planning – Introduction
Part E: Production Planning Process
Part F: Procurement Process
Part G: SAP & Enterprise Resource Planning
Part H: Simulation Theory and Simulation Models

This module provides students with foundational knowledge in developing technologies and innovation by combining business theory with practical guidance. Through engaging in discussions on the dynamics of technological development through innovation and related management issues and practices, students will be able to proficiently navigate the various dynamics in technology- or innovation-based business environments. Students will also be able to demonstrate the principles of the primary four forces of innovation and identify the critical role that finance plays in innovation to lead to job creation and economic growth.
The module will provide insights into the core elements of Industry 4.0 such as: introduction to Cyber-Physical System, Radio Frequency Identification (RFID) technologies, information collection with intelligent sensors, industrial networking to connect the machines and processes together, Manufacturing Execution System (MES) for order management, production control and value adding to the complete supply chain management.
This module will give a brief introduction to intellectual property rights and focus on insights into general principles of patent law and international conventions governing the patent law. Current developments and criticism of the current patent law system will also be addressed. In addition, practical (legal) aspects of the commercialisation of patents will be dealt with.
This module introduces the principles of Project Management, which addresses the key aspects of the project management processes and frameworks for successful projects. The skills and understanding of principles of project management is a key for the project manager to lead, plan, and implement projects to help their organisations succeed by achieving the common objectives within designated scope, cost, and timeline. The module introduces tools, techniques, and frameworks to engage effective stakeholders’ communication, monitor the project life cycle, and consistently develop the project with its deliverables. In this course, the student will learn how to initiate, manage, monitor, and then close the project. This module will also include a basic understanding of predictive and adaptive approaches commonly used in various projects and various industries.
*Disclaimer: Specialisation and Elective modules available for selection are subject to availability. Unforeseen circumstances that affect the availability of the module include an insufficient number of students taking up the module and/or the unavailability of the professor. TUM Asia reserves the right to cancel or postpone the module under such circumstances.

Global Internship

Gain real-world experience through internships, where you can take an active role in securing opportunities at a company of your choice, anywhere in the world.

The internship programme is one of the hallmarks of all our master’s programmes designed to provide structured and supervised work experiences. Students complete a three-month internship with the industry or an academic institution of choice related to his or her field of study at TUM Asia.

Internship can be completed anywhere in the world.

Students are empowered and given the freedom to pursue internship in their desired fields anywhere in the world and explore the possible career pathways developed from their field of study
based on their career goals and aspirations.

Our Students’ Internship Experience :

[Fabian D’ Cruz]
[Occupation]
[Class of 2022, Master of Science in Rail, Transport and Logistics ]

PLAY VIDEO

Master’s Thesis

A six-month journey that enables you to apply the best of your knowledge and skills acquired through course work and research assistantships

Through this guided learning experience, students work in collaboration with industry partners or other researchers on a project of mutual interest and gain the opportunity to publish manuscripts.

The master’s thesis is fully practical based. Theoretical frameworks or conceptual models can be occasionally used to guide research questions.

Admission Criteria

Applicants must have a bachelor’s degree in Electronics, Electrical Engineering or Physics. A good understanding of semiconductor physics, electromagnetic and organic chemistry (or electrochemistry).

Required Test Scores

For applicants whose native language or language of instruction from previous studies is not English, a TOEFL / IELTS score is required.
For more information:
  • TOEFL (www.toefl.org): Recent score with a Minimum 88* for the Internet-Based Test (TOEFL code: 7368)
  • IELTS (www.ielts.org): With academic IELTS result of at least 6.5

For applicants with a Chinese, Vietnamese or Indian university degree, an Akademische Prüfstelle (APS) certificate is required.

Find out more about our application process

For applicants whose native language or language of instruction from previous studies is not English, a TOEFL / IELTS score is required. For more information:

  • TOEFL (www.toefl.org):
  • IELTS (www.ielts.org):
IELTS

6.5

With academic IELTS result of at least 6.5
TOEFL

88+

Recent score with a Minimum 88* for the Internet-Based Test (TOEFL code: 7368)

For applicants with a Chinese, Vietnamese or Indian school or university degree, an Akademische Prüfstelle (APS) certificate is required.

For more information, please visit here.Link

Fees & Finances

Tuition Fees​

The tuition fees are payable upon acceptance of offer across 3 instalments throughout the academic year.

Payment can be made through:

Registration Fee 1st Instalment 2nd Instalment 3rd Instalment Total*
Payment Schedule
Upon acceptance of offer
15 July
1 December
1 July (of the next year)
Gross Amount* (before GST)
S$5,000.00
Payable across 3 instalments
S$49,000.00
Final Amount* (after GST)
S$5,450.00
Payable across 3 instalments
S$53,410.00

Total programme fee: S$53,410* (inclusive 9% GST)

  • All fees quoted are in Singapore Dollars and are inclusive of the prevailing Goods and Services Tax (GST) imposed under the Singapore GST Act. The GST rate has been adjusted to 9% starting from 1 January 2024
  • Tuition fees are subject to changes in Government Legislation or duly determined by the University Management. Students will be informed accordingly.
Scholarships
Admissions FAQ

Additional Information

  • Matriculation fees at TUM, teaching and examination fees
  • Lab materials and expenses
  • Expenses for intercultural program, may include tickets for events and industry excursions
  • Soft copy files of all teaching materials
  • IT usage: Internet access
  • Excursion and off-campus expenses for mandatory events
  • Usage of all university facilities at TUM and TUM Asia
  • Student Visa Processing and Issuance Fee (payable to the Immigration & Checkpoints Authority (ICA) Singapore
  • Student Services Fees*
  • Health Service Fees*
  • Application Fees*: Applicants are required to pay a non-refundable NTU application fee of SGD 50 when sending in their admission application.

*The fees are payable to the Nanyang Technological University (NTU). Note: Fees are subject to revision. All prices would be inclusive of the prevailing GST rates. The respective amounts and payment instructions will be provided in the Student Agreement to all successful applicants

  •  

Professors

Prof Koch
Prof. Dr.-Ing. Dr. H.C. Alexander W. Koch
Dr. Gabriele
Prof. (a.i.) Dr. Gabriele Schrag
Screenshot 2019-05-27 at 3.25.31 PM
Prof. Tay Beng Kang
Screenshot 2019-05-24 at 1.35.33 PM
Dr.- Ing Josef Biba
TornowMarc
Prof. Dr. Marc Tornow
Gagliardi_Alessio_AE_fotoshop
Prof. Dr. Alessio Gagliardi
StaffPhoto
Assoc. Prof. Poenar Daniel Puiu
EH20090610062
Prof. Dr. Gerhard Wachutka
ZhangDaoHua
Prof. Zhang Dao Hua
Prof Tang Xiaohong _StaffPhoto
Assoc. Prof. Tang Xiaohong
StaffPhotAssoc Prof Wang Hong_o
Assoc. Prof. Wang Hong
Assoc Prof Wong Kin Shun, Terence_StaffPhoto
Assoc. Prof. Wong Kin Shun, Terence
Assoc Prof Fan Weijun_StaffPhoto
Prof. Fan Weijun
Assoc Prof Zhou Xing_ StaffPhoto
Assoc. Prof. Zhou Xing

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